Imidazolyl-urea compounds and their use as cure accelerators in epoxy resin compositions

ABSTRACT

This invention is directed to a compound of the formula ##STR1## wherein the substituents are defined hereinbelow. These compounds are used as accelerators in epoxy resin compositions, comprising (a) an epoxy resin, (b) dicyandiamide and optionally (c) solvents, fillers, reinforcement materials or inert materials, pigments or aids, for the production of moldings.

The invention relates to imidazolyl-urea compounds and their use as cureaccelerators in epoxy resin compositions, comprising (a) an epoxy resin,(b) dicyandiamide and optionally (c) solvents, fillers, reinforcementmaterials or inert materials, pigments or aids, for the production ofmoldings.

Epoxy resins can be hardened by using the dimer of cyanamide(dicyandiamide) as a hardening agent. Two processes are currently usedfor compositions for production. In one process, known as the wet-in-wetprocess, the hardening is effected in one step. Reinforcement materialsare first impregnated with a curable mixture, then are stacked in a wetstage while being shaped and finally are cured by the action of heat inone step to form the thermosetting final products.

In the other process, the hardening is effected in two steps. Accordingto this process, so-called "prepregs" are first produced fromreinforcement materials and the curable mixture, and the prepregs arefurther processed to finished articles in a second process step carriedout at a different time. In this method, a liquid epoxy resin isconverted into a solid, but still fusible B-stage resin, which is thenfurther hardened into a non-fusible product.

The production of prepregs is normally carried out in a continuousprocess, in which reinforcement materials are led through animpregnation bath of a solution of the resin-hardener mixture which isto be used. The quantity of impregnating agent which is to be applied toa particular substrate is controlled by the nip rolls fitted downstreamof the impregnation bath as well as by the viscosity of theresin-hardener solution. After the impregnation process is complete, thesolvent contained in the impregnation solution is evaporated by theintroduction of heat and simultaneously the resin system is transformedfrom the A stage to the B stage. Depending upon the process conditionsand the resin system used, a slightly tacky to almost dry prepreg can beproduced from the impregnated reinforcement materials. It is importantin this process step, that, on the one hand, the solvent of theimpregnation mixture is completely removed, and on the other hand, thatthe latent hardener which is necessary for curing the prepreg in thesecond process step is not triggered, in order to prevent an undesiredreaction of the impregnated reinforcement materials.

The prepregs which are obtained in this way can be temporarily storedand transported as rolls, before they are cut to the desired size andare stacked one on top of the other in the component thickness. Theprepreg stack is cured by the simultaneous effects of pressure andtemperature to a high-strength molding, while the still low molecular,flowable resins are being transformed into the high molecular C-stage ofthe thermosetting product.

The criterion for curing using the single and two step processes is thatlong open times and short curing times at low curing temperatures arerequired. Moreover, a further criterion of the two step process, is thata prepreg must be stable for storage for a long period of time. In thelatter process, a storage temperature which is below room temperature isbecoming less commonly used in commercial practice.

It is important that after the production of the curable mixture whichis ready for use, the viscosity of the material remains substantiallyunchanged for the maximum amount of time.

This constant viscosity is required in order to achieve a consistentapplication of the resin and a constant B stage, since the productionconditions cannot be continually adjusted to the varying characteristicsof the curable mixture. Moreover, if the curable mixture had varyingcharacteristics, the physical properties of the cured final productswould thereby be adversely affected.

In practice, a curable mixture is sought having the followingcharacteristics: its viscosity remains constant for a relatively longtime in the impregnation bath; it converts at low temperatures in ashort time to the B stage; and it can be stored as a prepreg for a longtime at room temperature without chemical changes. Further, curingshould be carried out at the lowest possible temperatures within a shorttime; the maximum temperature of the exothermic reaction should remainlow even with relatively large layer thicknesses; and the physicalproperties of the final product should be suited to the requirements inpractice. In other words, the transition temperatures determined by thematrix should be above 140° C.

Therefore, as a rule, the dicyandiamide which has long been used as ahardener in curable mixtures based on epoxy resins is combined withco-curing agents and/or accelerators in order to achieve the desiredproperties. A large number of proposals in this field are thereforeknown from the literature.

U.K. Patent No. 1,349,709 describes a process for hardening epoxy resinsusing monomeric cyanamide. The subject matter and the descriptionstherein are incorporated herein by reference with the same force andeffect as if fully set forth herein.

The use of amine, as accelerators, e.g., tertiary amines, such asbenzyl-dimethylamine, tertiary/secondary amines such as2-methylimidazole, 2-ethyl-4-methylimidazole, or tertiary/primary aminessuch as 1-aminoethylimidazole singly or mixtures thereof, admittedlybrought gradual improvements. But, they did not eliminate all of thedeficiencies.

The use of dry monomeric cyanamide, replacing dicyandiamide, assuggested in DE-AS No. 2,122,955, was just as unattractive as thesuggested associated use of aliphatic and cycloaliphatic primarymonoamines or diamines containing primary and secondary amino groups.

The literature also discloses other compounds as accelerators, such as,those which contain one or two urea groups in the molecule, e.g.,N,N-dimethylurea compounds (See U.S. Pat. Nos. 3,661,989, and 3,717,612)or imidazolylureas (See EP-A-No. 193,068, U.S. Pat. Nos. 4,533,7154,358,571, and 4,335,228). These references are incorporated herein byreferences with the same force and effect as if fully set forth herein.

The use of these compounds as accelerators alone or in combination withbenzyldimethylamine or C- or N-substituted imidazoles admittedlyproduced improvements with regard to the storage stability or the curingcharacteristic or the final physical properties. But the overall levelof properties of the final products still required improvements.

Thus, the object of the present invention is to find a means ofovercoming the disadvantages of the prior art. In particular, the objectof the present invention is to find curable mixtures based on epoxycompounds, latent curing agents and cure accelerators, wherein saidmixtures are stable even in the B stage at room temperature for a longperiod of time, but which at the same time harden at relatively lowtemperatures and in short times without high exothermic temperaturepeaks to form the thermosetting final products Moreover, the object ofthe present invention is to find a curable mixture describedhereinabove, wherein its heat resistance corresponds to those which arerequired in practice.

This object is achieved by the addition of a cure accelerator, whichcontains at least two different urea components in the molecule.

More specifically, the invention relates to compounds of the generalformula (I), ##STR2## in which R is an aliphatic, cycloaliphatic, arylor araliphatic group,

R¹ and R² are independently H, lower alkyl or aryl,

R³ is a chemical bond or ##STR3## Z and Z¹ are independently O or NH; R⁵is R;

R⁴ is lower aliphatic, aryl, aryl lower aliphatic or cycloaliphatic.

When R³ is a chemical bond, the compound of Formula I has the formula##STR4##

When R³ is other than a chemical bond, the compound of Formula I maycontain one or more urea or urethane groups, ##STR5## wherein Z is O orNH.

As used herein, the term, aliphatic group is an alkylene chaincontaining up to 10 carbon atoms which may be substituted with inertgroups, such as alkyl groups, such that the total number of carbon atomsin the aliphatic group does not exceed 15. The preferred aliphatic groupis lower aliphatic, i.e., the total number of carbon atoms in the loweraliphatic group contains 1-6 carbon atoms. The alkylene chain may be astraight chain or branched chain and may include such radicals, as,e.g., methylene, ethylene, isopropylene, butylene, hexylene,isobutylene, t-butylene, sec-butylene, and the like.

The term cycloaliphatic group is a cycloalkyl group containing from 3 to10 carbon ring atoms. Moreover, said cycloaliphatic groups may besubstituted with other inert groups, such as alkyl, so that the totalnumber of carbons does not exceed 15 carbon atoms. The cycloaliphaticgroup may be monocylic or bicyclic. Such groups include cyclopentyl,cyclohexyl, cyclooctyl, decalinyl and the like, and the alkylsubstituted groups, such as ##STR6## and the like.

As defined herein the term aryl is an aromatic radical containing from 6to 10 ring carbon atoms which may be substituted by inert groups, suchas alkyl groups, so that the total number of carbon atoms does notexceed 15 carbon atoms. These groups include, phenyl, α or β-napthyl,xylyl, tolyl, and the like.

The araliphatic group as defined herein is an arylalkyl group. Thealkylene and aryl groups are as defined hereinabove. Examples includebenzyl, phenethyl and the like.

The preferred R groups are ##STR7## 2,4-tolyl, 2,6-tolyl,4,4'-diphenylmethyl, hexamethylene and o-, m- or p-xylyl.

The term lower alkyl as used herein is an alkyl group containing 1-6carbon atoms. These groups may be straight-chained or branched. Thesegroups include methyl, ethyl, propyl, isopropyl, butyl, sec-butyl,isobutyl, t-butyl, pentyl, amyl, hexyl and the like.

The preferred R¹ and R² groups are hydrogen, methyl, ethyl and phenyl.

The most preferred R¹ group is ethyl and the most preferred R² group ismethyl.

The compounds of Formula I of the present invention can be used asaccelerators in curable mixtures containing:

(a) epoxy resin

(b) dicyandiamide and optionally

(c) solvents, fillers, reinforcement materials or inert materials,pigments, or aids.

The invention further relates to curable epoxy resin compositionscontaining

(a) an epoxy resin having, on average, more than one epoxy group permolecule,

(b) dicyandiamide

(c) compounds of Formula I as cure accelerators and

(d) optionally solvents, fillers, reinforcement material or insertmaterials, pigment, or aids.

The invention further relates to curable mixtures which arecharacterized in that the reinforcement materials are impregnated atroom temperature with a binder, whereby said binder comprises

(a) epoxy resin

(b) dicyandiamide

(c) solvent and

(d) a cure accelerator containing a compound of Formula I, which iscapable of being converted into a semisolid, but still fusible B stage(resin).

The invention further relates to epoxy resin moldings, which arecharacterized in that in the first step the reinforcement materials areimpregnated at room temperature with a binder, whereby said bindercomprises

(a) epoxy resin

(b) dicyandiamide

(c) solvent

(d) a cure accelerator containing a compound of Formula I, and saidbinder is converted into the semisolid, but still fusible B stage resinand in a second step the prepregs produced in this way are cured ontheir own by the application of pressure at elevated temperature to forma non-fusible product.

The epoxy resins according to the invention which are used are glycidylesters and glycidyl ethers with two or more epoxy groups per molecule.These include, the glycidyl ethers based on monohydric or polyhydricphenols. Suitable epoxy compounds for use in the present invention areprimarily polyglycidyl ethers (especially diglycidyl ethers) that areliquid at room temperature and are derivable from (i) a polyhydricphenol (especially a bisphenol), a novolak or a polyhydric alcohol(especially a diol, for example polypropylene glycol) and (ii)epichlorohydrin. (A glycidyl group is a 2,3-epoxy-propyl group). Thecorresponding methylglycidyl ethers (that is 2,3-epoxy-2-methyl-propylethers) are also suitable and may be prepared from a compound named at(i) and methylepichlorohydrin (that is1-chloro-2,3-epoxy-1-methyl-propane).

Other suitable compounds include glycidyl esters of polycarboxylic acids(including dicarboxylic acids), especially those acids of the aromaticseries (for example phthalic acid) or of the aliphatic series.

Epoxy compounds obtained by the epoxidation of olefinic compounds arealso suitable. A mixture of two or more of the above-mentioned epoxycompounds may be used. Furthermore, a mixture of one or more of saidcompounds with an "active diluent" may be used. A monoglycidyl ether ofan alcohol or phenol or a monoglycidal ester of a carboxylic acid,especially an aromatic or aliphatic carboxylic acid, is very suitable asan active diluent. Throughout this specification, the term "poly" isintended to include the term "di".

The various epoxy groups that can be utilized is described in U.K. Pat.No. 1,349,709, which is incorporated herein by reference with the sameforce and effect as if fully set forth herein.

Glycidyl ethers having 1,2-epoxy resins, e.g.,2,2-bis(4-hydroxy-phenyl)propane (bisphenol A) are preferred. It ispreferred that said glycidyl ether have an epoxy equivalent weightranging from 190 to 400. It is especially preferred that the epoxyresins have epoxide values of 0.2-0.6 particularly with the compoundswhich are liquid at room temperature. Even more preferred epoxy resinshave epoxide values ranging from 0.45 to 0.55. Additionally, glycidylethers based on bisphenol F and the Novolake resins have also provedadvantageous.

The dicyandiamide which is co-used as curing agent is a commerciallyavailable product and is obtainable under known trade names. Thequantity of dicyandiamide, depending on the epoxy compound used, is inthe range of 2 to 10 parts per weight per 100 parts by weight ofdiglycidyl ether. When the preferred liquid glycidyl ethers, such asbisphenol A, are used, the amount of dicyandiamide used is in the rangeof 5 to 10 parts by weight, based on 100 parts by weight of diglycidylether.

The cure accelerators which are co-used according to the invention arecompounds of the general Formula (I), wherein R, R¹ and R² are definedhereinabove.

The cure accelerators can be formed by procedures which are known to oneskilled in the art. For example, the compounds of formula (I) can beproduced by reacting an isocyanate of the formula

    O═C═N--R--N═C═O                            II

with an imidazole of the formula ##STR8## and dimethylamine where R, R¹and R² are as described above, under imidazolyl urea forming conditions.The imidazole is first added to the reaction mixture, followed almostimmediately thereafter with dimethylamine to form the compounds ofFormula I.

It is also possible to use prepolymers of the diisocyanates containingurethane groups or urea groups instead of the diisocyanates. In the caseof isophorone diisocyanates, the more reactive isocyanate group isalready to a large extent converted by a preliminary reaction of thiskind with the hydroxyl group, so that the less reactive isocyanate groupparticipates preferentially in the subsequent reaction with the aminecomponents. The reaction of the isocyanates with the imidazoles and thedimethylamines is preferably carried out in a solvent, which can alsodissolve dicyandiamide, so that a mixture is obtained which is ready foruse for the production of prepreg.

Products formed may contain some byproducts but they may be used asaccelerators, without purification. It is also possible to have mixturesof the individual pure components in each case.

Various isocyanates can be used. However, these isocyanates must have atleast two isocyanate groups for reaction with the amines. Preferredgroups are:

Isophorone diisocyanate (IPDI), tolylene diisocyanate (TDI), such as2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, diphenylmethanediisocyanate (MDI), such as 4,4'-diphenylmethane diisocyanate,hexamethylene diisocyanate (HDI), trimethylhexamethylene diisocyanate(TMDI), xylylene diisocyanate (XDI), tetramethyl xylylenediisocyanate(TMXDI) and mixtures of these, as well as the products of dimerizationand trimerization of the corresponding isocyanates. Other diisocyanatesthat could be used include orthophenylene diisocyanate, metaphenylenediisocyanate, paraphenylene diisocyanate, or isomeric mixtures thereof,3,3'-dimethyl-4,4'-biphenyl diisocyanate and the like.

Alternatively, the diisocyanate adduct can be extended prior to reactingwith the imidazole and the dimethylamine. For example, the diisocyanatecan be reacted with alcohols to form the corresponding prepolymerisocyanates containing one or more urea or urethan groups with residualisocyanate groups which in turn can react with the imidazole of FormulaIII and the dimethylamine. Using this method, it is preferred that adiol be used and that the molar ratio of diisocynate to diol be 2:1. Forexample, the isophoronodiisocyanate is reacted with butanediol in amolar of 2:1 and the product formed therefrom is reacted with imidazoleand dimethylamine to form the product of Formula I, wherein R is##STR9##

The imidazoles utilizable in this invention are known and many arecommercially available. Typical imidazole include imidazole,2-methyl-imidazole, 2-ethylimidazole, 2,4-diethylimidazole, 2-ethyl4-methylimidazole, 2,4,5-trimethylimidazole, 2-benzylimidazole,4-methylimidazole, 2-phenylimidazole.

The preferred imidazoles are 2-methylimidazole and2-ethyl-4-methylimidazole.

The quantity of cure accelerator can be varied within wide limits. It isdetermined by the intended application and the curing conditions whichmay thus be prescribed. According to the invention, quantities in therange of 0.1 to 10, preferably 1 to 5 parts by weight, based on 100parts by weight of epoxy compound are used.

In the one process step, anhydrous dicyandiamide is dissolved in theepoxy compound at abouit 50° C. If the solution so formed is then leftto stand at room temperature, it may remain unchanged for several daysor even weeks depending on the stability of the dicyandiamide and theimpurities present in the resin. After the expiry of this "initiationperiod", the solution is in the form of a layer not more than about 1 cmthick, this spontaneous hardening will result in the formation of aB-stage product. However, if the solution is in the form of a largebatch, the hardening will result in the formation of a non-fusibleproduct, without an intermediate B-stage product being formed. Thereason for this is that the reaction between the resin and thedicyandiamide is strongly exothermic. If the heat formed can bedissipated rapidly enough, for example, by using only a thin layer ofsolution, the intermediate B-stage product will be formed, whereas ifthe heat accumulates in the solution it will cause the reaction toproceed right through to the final non-fusible product. A further methodof dissipating the heat is to add a filler to the solution.

If it has not already become hardened, the solution may be hardened whendesired by heating it to from 100° to 200° C.

The quasi-latent system described above may be used in practice for avariety of purposes. For example, it may be used to produce glass-fibrereinforced plastics materials, for example shaped components, panels,tubes, bonds or coatings, directly from the liquid phase by heating to atemperature of from 100° to 200° C. It can also be used for themanufacture of casting resins, provided that excessive heat accumulationis prevented as this might cause fissuring or even charring; this cangenerally be avoided by adding a filler or by using other means todissipate the heat.

The reaction between the epoxy compound and the dicyandiamide can be"catalyzed" by the use of a small quantitiy of cure acceleratoraccording to the present invention. This results in a decrease in thetime and/or temperature needed for hardening, with a consequent decreasein the length of the "initiation period" and thus of the pot-life of thesolution.

Instead of hardening the dicyandiamide/resin mixture in one step asdescribed above, by heating it to from 100° to 200° C., the mixture maybe hardened in two steps: in a first step a mixture of an epoxy resinand anhydrous dicyandiamide is converted at a temperature of from 20° to160° C. into a solid, but still fusible, B-stage product, and this isthen cured, in a second step, at from 100° to 200° C. The formation ofthe B-stage product may take several days if a relatively lowtemperature is used but may only take a few minutes if a highertemperature is used. The accelerator of the present invention ispreferably added to the mixture in order that the B-stage product may beformed within an acceptable period.

The compositions of the invention can additionally comprise one or morefillers, reinforcing agents (for example fibres or fabrics), pigmentsand other adjuvants.

In order to modify the properties of the final product, in addition toother epoxy resins, modifiers or aids can also be co-used such asphenolic resins, melamine resins, silicone resins, or inorganic andorganic fillers such as powdered quartz, titanium dioxide, carbon black,silicone rubber or butadiene rubber or additives such as pigments andcolorants. Fillers may be generally used to increase performance at hightemperature, reduce the coeffecient of thermal expansion, increasethermal conductivity, decrease skrinkage (by reducing peak exothermtemperature) and alter moisture resistance. Suitable fillers includecalcium, carbonate, talc, aluminum oxide, flint powder, silica, mica,and metallic powders (Al, Zn, and the like).

Common pigments that may be used include titanium dioxide, aluminumpowder, carbon black, and cadmium red medium and codmolith golden, bothproduced by The Chemical and Pigment Co.

To adjust to the desired viscosity, resins of different viscosity or(reactive) diluents can be added. Moreover, inert but volatile solventscan also be added. These include dimethyl formamide, acetone,methylglycol or mixtures of these.

In order to produce the prepregs, organic and inorganic fibers, fibremats or fabrics based on aramides, carbon or cellulose, metals such asboron, steel, and so on, or ceramics, particularly glass, may beimpregnated with the epoxy dicyandiamide/accelerator mixture, inaccordance with the procedure described hereinabove, and these areconverted to a B-stage product at room temperature or at elevatedtemperatures.

The production of the prepregs is carried out in accordance with methodsknown per se, in which the reinforcement materials or the substratematerials are soaked in an impregnation bath with the reactive resinmixture and after nipping off the excess quantity of resin they arecontinuously converted from the A stage to the B-stage product by theintroduction of energy (mostly heat), with simultaneous removal of thesolvent which may optionally be present. Depending on the desiredprepreg consistency (tacky to solid), the prepregs are subsequentlyprovided on both sides with a release film and are rolled up for storageand transport. Further processing is carried out by cutting theindividual layers of prepreg to size and laying them together to form astack, from which a highly cross-linked component is produced by shapingprocedures with the simultaneous introduction of heat.

The accelerators according to the invention can moreover be successfullyused in solvent-free systems based on dicyandiamide and epoxy resins. Atypical field of application is the use of hot-curing single componentadhesives for the bonding of body components in the automobile industry(seam beading cement).

A thermosetting composition may be prepared from the above-mentionedpreferred preparation of the invention by converting the preparationinto a B-stage product at from 20° to 160° C. and then (if a temperatureabove room temperature has been used) cooling the product. In somecircumstances it may be necessary to use rapid cooling in order toprevent the B-stage product becoming converted into a non-fusibleproduct within, for example, 24 hours. It is necessary to prevent theformation of cross-linked products by heat accumulation. When the filler(for example glass fibre) content is fairly high, as is usually the casein formulation moulding compositions or prepregs, the inorganic fillermaterial is generally capable of absorbing the heat of reaction. Whenthe filler content is low, or the composition is unfilled, as, forexample, in the manufacture of powder lacquers, heat accumulation can beprevented by allowing the composition to solidify in flat dishes in nottoo thick a layer.

The heat-curable epoxy resin compositions obtained in this manner can befurther processed, with or without fillers and the like, in the form of,for example, adhesives, coatings or moulding compositions.

One especially noteworthy advantage of the invention is that it enablespowder lacquer formulations to be prepared on normal roller mills atroom temperature instead of with special extruders at elevatedtemperatures as has hitherto been necessary.

The following Examples further illustrate the invention.

EXAMPLE I Production of an accelerator according to the invention fromisophorone diisocyanate (IPDI), 2-ethyl-4-methylimidazole (EMI 2,4) anddimethylamine.

111 g IPDI (0.5 mol) are preheated in 111 ml of carbon tetrachlorideunder nitrogen to about 40° C. A solution of 55 g (EMI 2,4) (0.5 mol) in55 ml of carbon tetrachloride is added with stirring over 1 hour. Atemperature of 40°-50° C. is maintained for about 2 hours and, aftercooling to room temperature, 22.5 g of dimethylamine (0.5 mol) is added.A highly viscous yellow solution is produced, which is freed fromsolvent at about 50° C. in vacuo. The reaction product has a softeningpoint of about 82° C. and shows no N═C═O bands in the IR spectrum. It issoluble in acetone, methyl ethyl ketone, methylene chloride, carbontetrachloride and propylene glycol monomethyl ether.

EXAMPLE IA Production of a prepreg mixture from I without the co-use ofdicyandiamide

The accelerator according to the invention is mixed at room temperature(RT) with dimethylformamide in a ratio of 1:5 by weight. An impregnationmixture suitable for the production of prepregs is produced from 60parts by weight of this accelerator solution by addition of 100 parts byweight of a medium viscosity epoxy resin (weight of one equivalent ofepoxide, about 190).

In order to produce prepregs on the laboratory scale, a glass filamentfabric about 0.1 m² in size, in the sateen weave (296 g/m²) is soaked inthe impregnation mixture and subsequently given heat treatment for 5minutes at 100° C. in the forced-air oven. Flexible, but highly tackyand thus scarcely manipulable prepregs are obtained with a resin contentof about 30% by weight, which do not change significantly in consistencyeven after several days storage between polyethylene films.

After a temporary storage of at least 24 hours, 2 prepreg layers in eachcase are pressed by hot press molding at 120° C. and 0.1 bar for 30minutes. The final product has an exceptionally low rigidity for glassfabric reinforced EP resin systems. The transition temperaturedetermined from the torsion pendulum test (DIN 53445) is 65° C. Theprocedure from the torsion pendulum is described in said reference andthe procedure therein is incorporated by reference with the same forceand effect as if fully set forth herein.

EXAMPLE II Production of an accelerator according to the invention fromisophorone diisocyanate, 2-ethyl-4-methylimidazole and dimethylamine indimethyl formamide (DMF)

55.5 g IPDI (0.25 mol) are preheated in 55.5 g of dimetyl formamideunder nitrogen to about 40° C. A solution of 27.5 g EMI 2.4 (0.25 mol)in 27.5 g of dimethyl formamide is added with stirring over 1 hour. Atemperature of 40°-50° C. is maintained for about 2 hours and aftercooling to room temperature, 11.25 g of dimethylamine (0.25 mol) is runin.

The reaction product is a solution of about 50% strength in dimethylformamide and shows N═C═O bands in the IR spectrum.

EXAMPLE IIA Production of a prepreg reaction mixture from II with theco-use of dicyandiamide

The solution of:

24 g of dicyandiamide and

21 g of reaction product II in

135 g of dimethyl formamide

is mixed to a concentration of 60 parts per 100 parts of resin with anepoxy resin (weight of one equivalent of epoxide, about 190) and usedfor the production of prepregs. The viscosity of this impregnationsolution, measured with a cone and plate rheometer at 20° C. (supplierEpprecht Instruments), is 0.09 Pa.s and does not measurably change withstorage at room temperature even after several days.

When used for the production of prepregs as described under point Ia.and the curing time is altered from 5 minutes to 10 minutes, flexible,slightly tacky products are obtained. These can be cured to formthermoset moldings even after storage at room temperature betweenpolyethylene films for more than 4 weeks, without loss of properties.The transition temperature of the cured products, determined by thetorison pendulum test in accordance with DIN 53445 is 156° C. and thisvalue is not reduced even after storage of the test pieces at 60° C. for90 hours.

EXAMPLE IIb Production of a prepreg reaction mixture from II withoutco-use of dicyandiamide

The accelerator according to the invention is mixed at room temperaturewith dimethyl formamide in the ratio 2:4 by weight. An impregnationmixture which can be used for the production of prepregs is producedfrom 60 parts by weight of this accelerator solution by addition of 100parts by weight of a medium viscosity epoxy resin (weight of oneequivalent of epoxide, about 190), and this impregnation mixture isprocessed as described in Example Ia. The transition temperaturedetermined from the torsion pendulum test (DIN 53445) is also at thelevel of Example Ia.

EXAMPLE III The production of an accelerator from butanediol, isophoronediisocyanate, 2-ethyl-4-methylimidazole and dimethylamine.

88.8 g of IPDI (0.4 mol) are preheated in 97.8 g of dimethyl formamideunder nitrogen to about 75° C. 18.0 g of 1,4-butanediol (0.2 mol) in 18g of dimethyl formamide are added dropwise and the reaction mixture keptat 75° C. for about 1.5 hours. After cooling to room temperature, 22.0 gof EMI 2,4 (0.2 mol) in 22 g of dimethyl formamide are added over 30minutes. Subsequently 9.0 g of dimethylamine (0.2 mol) are run in atroom temperature.

The reaction mixture is a 50% strength solution in dimethyl formamideand shows no N═C═O bands in the IR spectrum.

EXAMPLE IIIA Production of a prepreg reaction mixture from III with theco-use of dicyandiamide

The solution comprising

24 g of dicyandiamide and

24 g of reaction product III in

132 g of dimethyl formamide

is mixed to a concentration of 60 parts per 100 parts of resin with anepoxy resin (weight of one equivalent of epoxide, about 190) and usedfor the production of prepregs.

The viscosity of the impregnation solution measured with the cone andplate rheometer is 0.10 Pa.s at 20° C. In the case of the (flexible,slightly tacky) prepreg produced according to Example Ia. and furtherprocessed after a 4-week temporary storage at room temperature, atransition temperature of 143° C. is determined in the torsion pendulumtest (DIN 53445).

For exact comparison of the accelerators according to the invention withthe accelerators according to the state of the art,dicyandiamide/accelerator formulations were prepared, in which the totalnitrogen content of the accelerator components was calculated to havethe same value.

EXAMPLE IV

The 50% strength solution described in Example II of the reactionproduct from 1 mol of IPDI with 1 mol of 2-ethyl-4-methylimidazole and 1mol of dimethylamine is used in the following formulation:

4.0 g of dicyandiamide

2.9 g of solution II, containing 1,45 g of accelerator (18.6% N),

23.1 g of dimethyl formamide (analytically pure).

This solution is mixed to a concentration of 60 parts to per hundredparts of resin with an epoxy resin (weight of one equivalent of epoxide,about 190). Test results are given in Table I.

EXAMPLE V

V. N,N-dimethyl-N'-phenylurea is produced by a known process fromequivalent quantities of phenylisocyanate and dimethylamine. Afterrecrystallization from water the product has a melting point of 134° C.The N-content is 17.1%.

The following dicyandiamide accelerator solution is produced from thisproduct.

4.0 g of dicyandiamide

1.5 g of N,N-dimethyl-N'-phenylurea (17.1% N)

24.5 g of dimethyl formamide (analytically pure)

This solution is mixed to a concentration of 60 parts per hundred partsof resin with an epoxy resin (weight of one equivalent of epoxide, about190). Test results are given in Table I.

EXAMPLE VI

111 g of IPDI (0.5 mol) are dissolved in 111 ml of acetone (analyticallypure). The solution is heated to 50 ° C. under nitrogen and slowly mixedwith 110 g of 2-ethyl-4-methylimidazole (1 mol) dissolved in 110 ml ofacetone (analytically pure). The temperature is kept at 50°-60° C. forabout 3 hours, so that no N═C═O bands remain detectable in the IRspectrum. After removal of the acetone a solid is obtained.

The N-content is 19.0%.

The following dicyandiamide accelerator solution is produced from thisproduct:

4.0 g of dicyandiamide

1.35 g of the product VI

24.65 g of dimethyl formamide (analytically pure)

This solution is mixed to a concentration of 60 parts per hundred partsof resin with an epoxy resin (weight of one equivalent of epoxide, about190). Test results are given in Table I.

    __________________________________________________________________________    Material characteristics at concentrations of accelerator which are equal     in                                                                            respect of total nitrogen content                                                         Viscosity of the                Transition tempera-                           impregnation solu/20° C.                                                                Kick-off                                                                             Reaction dura-                                                                        ture by Torsion                               upon being                                                                          after 6 days                                                                         In- temperature                                                                          tion at 120° C.                                                                Pendulum Test                     Example                                                                            Patent Status                                                                        produced                                                                            storage at RT                                                                        crease                                                                            by DSC measurement                                                                           (DIN 53445)                       __________________________________________________________________________    IV   according to                                                                         80 m Pa. s                                                                          80 m Pa. s                                                                           0%  132° C.                                                                       23 min. 151° C.                         the invention                                                            V    not according                                                                        70 m Pa. s                                                                          70 m Pa. s                                                                           0%  135° C.                                                                       22.4 min.                                                                             137° C.                         to the                                                                        invention                                                                VI   not according                                                                        80 m Pa. s                                                                          150 m Pa. s                                                                          88%  98° C.                                                                       15 min. 152° C.                         to the                                                                        invention                                                                __________________________________________________________________________

The viscosities of the impregnation solutions, shown in the Table I,were obtained as given above at 20° C. with a cone and plate rheometer,the solutions being stored in a closed vessel at room temperature for 6days between the 1st and 2nd measurement.

The kick-off temperatures which are also shown in the table weredetermined by DSC (apparatus TA 3000 supplied by Mettler) on freshlyprepared impregnation solutions starting from a temperature of 10° C.with a heating rate of 20° C./min. The duration of the reaction of thevarious impregnation solutions which is given results from the analysisof the kinetics, which was carried out by DSC measurements on theseproducts at a heating rate of 1° C./min.

The transition temperatures were determined in the torsion pendulum testin accordance with DIN 53445 using a heating rate of 1° C./min., thetest pieces, as described in Example Ia. being first of all formed intoprepregs and subsequently cured to form thermosets.

The results of these tests are tabulated in Table I.

The above embodiments and examples are given to illustrate the scope andspirit of the present invention. These embodiments and examples willmake apparent, to those skilled in the art, other embodiments andexample. The other embodiments and examples are with the contemplationof the present invention. Therefore, the present invention should belimited only by the appended claims.

What is claimed is:
 1. A compound of the formula ##STR10## wherein R isan aliphatic group, cycloaliphatic group, aryl group or araliphaticgroup andR¹ and R² are each independently hydrogen, lower alkyl or aryl,R³ is a chemical bond or ##STR11## Z and Z¹ are independently O or NH;R⁵ is R; R⁴ is lower aliphatic, arylene, aryl lower alkylene orcycloaliphatic, wherein the aliphatic group contains up to 10 carbonatoms in the principal chain and up to a total of 15 carbon atoms; thecycloaliphatic group contains up to 10 ring carbon atoms and up to atotal of, 15 carbon atoms; and the aryl group is an aromatic groupcontaining from 6 to 10 ring carbon atoms and up to a total of 15 carbonatoms.
 2. The compound according to claim 1 in which R is a chemicalbond.
 3. The compound according to claim 2 in which R¹ and R² areindependently hydrogen, methyl, ethyl or phenyl.
 4. The compoundaccording to claim 2 in which R is ##STR12##
 2. 4-tolyl, 2,6-tolyl,4,4,'-diphenylmethyl, hexamethylene and o-, m-, or p-xylyl.
 5. Thecompound according to claim 1 in which R is ##STR13##
 6. The compoundaccording to claim 2 in which R is ##STR14##
 7. The compound accordingto claim 3 in which R is ##STR15##
 8. The compound according to claim 3in which R is ##STR16## and R¹ is ethyl and R² is methyl.
 9. Thecompound according to claim 1 in which R³ contains urea or urethanegroups.
 10. The compound according to claim 1 in which R and R₅ are##STR17## and Z=O and R⁴ is n-C₄ H₈.
 11. A method of curing in a curablemixture comprising epoxy resins and dicyandiamides which comprisestreating the curable mixture with a catalytically effective amount of anaccelerator compound of claim 1 to accelerate the hardening of the epoxyresin.
 12. The method according to claim 11 wherein R¹ and R² areindependently hydrogen, methyl, ethyl or phenyl.
 13. The methodaccording to claim 11 wherein R is ##STR18##
 2. 4-tolyl, 2,6-tolyl,4,4-diphenylmethyl, hexamethylene or o-, m-, or p-xylyl,
 14. The methodaccording to claim 11 wherein R is ##STR19## and R¹ is ethyl and R² ismethyl.
 15. The method according to claim 11 wherein at least one memberof the group consisting of solvents, fillers, reinforcement materials,inert materials, pigments and aids is additionally present.
 16. Acurable epoxy resin composition which comprises a curing effectiveamount of epoxy resin having more than one epoxy group per molecule anda dicyandiamide and a catalytically effective amount of a cureaccelerator compound according to claim 1 in association with anadjuvant.
 17. The composition according to claim 16 wherein the adjuvantcomprises at least one filler, reinforcement material, inert material,pigment, aids or inert epoxy resin composition solvent.
 18. Thecomposition according to claim 16 wherein R¹ and R² of the cureaccelerator are independently hydrogen, methyl, ethyl or phenyl.
 19. Thecomposition according to claim 16 in which R of the cure accelerator is##STR20##
 2. 4-tolyl, 2,6-tolyl, 4,4'-diphenylmethyl, hexamethylene ando-, m-, or p-xylyl.
 20. The composition according to claim 16 in which Ris ##STR21## and R¹ and R² are independently hydrogen, methyl, ethyl andphenyl.
 21. The composition according to claim 16 in which R is##STR22## and R¹ is C₂ H₅ and R² is CH₃.
 22. The curable epoxy resincomposition according to claim 16 in which the quantitiy of cureaccelerator ranges from 0.1 to 10 parts by weight, based on 100 parts byweight of epoxy resin.
 23. The composition according to claim 22 inwhich the quantity of cure accelerator ranges from 1-5 parts by weight.24. The curable epoxy resin composition according to claim 16 whereinthe epoxy resin comprises a polyglycidyl ether of a polyhydric phenol.25. The curable epoxy resin composition according to claim 24 whereinthe polyglycidyl ether is a bisphenol.
 26. The curable epoxy resincomposition according to claim 25 wherein the bisphenol is bisphenol Awith epoxide values of 0.2 to 0.6.
 27. The curable epoxy resincomposition according to claim 26, wherein the bisphenol A has anepoxide value ranging from 0.45 to 0.55.